Recent Advances in Reactive Ion Etching and Applications of High-Aspect-Ratio Microfabrication
Michael A. Huff
Journal
- ISSN / E-ISSN
- — / —
- DOI
- 10.3390/mi12080991 ↗
- Volume · Issue · Pages
- 12 · 8 · 991-991
- Publisher
- Multidisciplinary Digital Publishing Institute (MDPI)
- Article URL
- https://doi.org/10.3390/mi12080991 ↗
- Article details
- Unverified
Publication date (each date has its type and source)
20 Aug 2021
OpenAlex publication date · source: OpenAlex
| Type | Date | Source |
|---|---|---|
| OpenAlex publication date | 20 Aug 2021 | OpenAlex |
Keywords (as given): reactive ion etching; high aspect ratio etching; deep reactive ion etching; inductively coupled plasma; bulk micromachining; anisotropic etching; silicon micromachining; fused silica; glass etching; silicon carbide; compound semiconductors; piezoelectric materials; 3D integration; microsystem fabrication
HEC Status at Publication Not the journal's current status
HEC Status at PublicationConclusive
HEC status at publication
Recognized
W
Based on the recorded HEC dataset applicable to the article's publication date. Listed as W in the HEC list for hjrs 2021-22 V2.
- Journal
- Micromachines
- Publication date used
- 20 Aug 2021 (OpenAlex publication date)
- Applicable HEC period
- hjrs 2021-22 V2 (version 1) · 01 Jul 2021 – 30 Jun 2022
- Category
- W
- Recognition status
- Recognized (OK_RECORD_FOUND)
- Source
- hjrs-2021-22 row 15371
- Verification status
- Verified against source · last verified 16 Oct 2026
This is an automatically generated summary based on the information available on the publication date. Terms & conditions apply.