Microstructure analysis of 8 μm electrolytic Cu foil in plane view using EBSD and TEM
Myeongjin Kim, Hyun Soon Park
Journal
- ISSN / E-ISSN
- — / —
- DOI
- 10.1186/s42649-022-00071-4 ↗
- Volume · Issue · Pages
- 52 · 1 · 2-2
- Publisher
- Springer Nature
- Article URL
- https://doi.org/10.1186/s42649-022-00071-4 ↗
- Article details
- Unverified
Publication date (each date has its type and source)
28 Mar 2022
OpenAlex publication date · source: OpenAlex
| Type | Date | Source |
|---|---|---|
| OpenAlex publication date | 28 Mar 2022 | OpenAlex |
Keywords (as given): electrolytic copper foil; microstructure; specimen preparation; mechanical polishing; elongation rate
HEC Status at Publication Not the journal's current status
HEC Status at PublicationNot conclusive
Historical status could not be conclusively determined.
- Some rows of the HEC list for this period are not yet matched to a journal, so absence cannot be proved. Pending verification.
Best available information, not a definitive status: Some rows of the HEC list for this period are not yet matched to a journal, so absence cannot be proved. Pending verification.
- Journal
- Applied Microscopy
- Publication date used
- 28 Mar 2022 (OpenAlex publication date)
- Applicable HEC period
- hjrs 2021-22 V2 (version 1) · 01 Jul 2021 – 30 Jun 2022
- Category
- —
- Recognition status
- Pending Verification (PERIOD_HAS_UNMATCHED_ROWS)
- Source
- —
- Verification status
- Unverified
This is an automatically generated summary based on the information available on the publication date. Terms & conditions apply.